Specifications

Abrasive type: diamond (D), aluminum oxide (AO), silicon carbide (SC)

Particle size (um): 45, 30, 15, 12, 9, 6, 3, 2, 1, 0.5, 0.3

Width (mm): 1.2, 1.6, 2.0, 2.5, 3.0, 3.2, 3.8, 5.0, 12.6

Length: 45m (150feet), 100m, 183 (600feet), 200m

*Note: In addition to the above specifications, various specifications can be customized according to customer needs.

characteristic

1. The product quality is stable and can achieve high grinding consistency;

2. High grinding force to achieve precise polishing effect;

3. It has good strength and flexibility, and can achieve ideal surface polishing effect;

4. It is applicable to dry polishing and polishing with water or grinding oil as the grinding medium.

Main applications

1. Motor commutator: used for grinding and polishing the surface of motor commutator, which can effectively remove oxide layer and dirt;

2. Roll: surface polishing of metal roll, ceramic roll, hard alloy roll, hard casting, etc; It has the advantages of good adhesion and high grinding force;

3. Hard disk and magnetic head: polishing the carbon layer of magnetic head and hard disk; Good durability and high grinding efficiency;

4. LCD: mainly used for polishing LCD color filter to effectively remove defects and stains;

5. Semiconductor material: edge polishing of semiconductor silicon wafer to remove the damage layer on the edge surface and obtain lower surface roughness;

6. Crankshaft and camshaft: used for precision grinding and polishing of crankshaft surface, with high grinding force and good polishing effect.